GXSC’s GX30 Broadband RF Heterogeneous Processing SoC for Software-Defined Radio (SDR)

Software-Defined Radio (SDR) shifts the functionality of traditional radio from hardware to software. SDR allows for changes to frequency bands, modulation schemes, communication protocols, and functions through software updates, without the need to replace hardware. An SDR system includes an RF front end, ADCs and DACs, and a digital signal processing (DSP) SoC, among other components. The SoC module within such a system can utilize GXSC’s GX30 broadband RF heterogeneous processing SoC.

The GXSC GX30 is a highly integrated broadband RF processing device that combines dual-channel direct-conversion RF transceiver functionality with a heterogeneous computing architecture consisting of programmable hardware acceleration and embedded multi-core processing. This architecture enables deterministic, low-latency signal processing, adaptive waveform control, and real-time spectrum analysis while minimizing the complexity of external systems.

The GX30 integrates a tightly coupled programmable hardware architecture with an embedded processing subsystem, specifically designed for hardware/software co-optimization. It integrates RF transceiver, FPGA programmable logic, an ARM multi-core processor, high-speed memory, digital baseband, and peripheral interfaces onto a single chip, making it an all-in-one RF baseband signal processing solution tailored for low-latency, real-time spectrum analysis, and programmable waveform communication scenarios.

GX30 Features:

1. Dual-core ARM architecture processor with a maximum operating frequency of 866 MHz and a 32-bit processing architecture

2. Programmable logic array equivalent to 85K logic cells

3. Supports external DDR3/DDR3L/LPDDR2 memory with a 16-bit interface

4. The RF subsystem integrates a broadband dual-channel direct-conversion transceiver optimized for high dynamic range and low phase noise operation

5. Frequency synthesizer with a fractional-N PLL architecture, featuring a switching time of approximately 80 μs

6. Supports a BGA625 package measuring 17 mm × 17 mm × 1.66 mm

7. Software support: Compatible with embedded Linux, RTOS, and bare-metal environments