GXSC DSP Replaces TMS320F28335 in Multi-Axis Positioning Systems

Multi-axis positioning systems achieve high-precision spatial positioning, trajectory reproduction, and automated operations through multi-axis coordinated motion and precise position closed-loop control. The real-time computational capability, peripheral integration, closed-loop control precision, and multi-axis scheduling capability of the motion control core processor determine the positioning resolution, trajectory smoothness, synchronization consistency, and dynamic response speed of the multi-axis positioning system. This system can utilize GXSC‘s industrial-grade high-performance 32-bit floating-point DSP, which is fully compatible with the TMS320F28335 and can serve as a direct replacement.

This domestically manufactured DSP features a main frequency of up to 150MHz, operates on a single 3.3V power supply, and integrates a powerful DSP core, large-capacity Flash memory, and a rich set of peripheral interfaces. It efficiently handles complex control algorithms and real-time data processing and is currently widely used in multi-joint robotic arms, CNC machining equipment, and three-dimensional displacement platforms. The DSP‘s integrated peripherals, including ADC, PWM, and various communication interfaces, can directly interface with signal acquisition, protection actuation, and data transmission links in power lines. This allows for the construction of a complete digital control system without the need for extensive external expansion components, simplifying system hardware design, improving system response speed and control precision. Furthermore, leveraging its flexible programming features, it can adapt to power line monitoring and protection requirements across different voltage levels and various application scenarios.

GXSC DSP Technical Features:

High-Performance Static CMOS Technology: 150MHz (6.67ns cycle time), 1.8V/1.9V core, 3.3V I/O design

High-Performance 32-Bit CPU: IEEE-754 single-precision floating-point unit (FPU), 16x16 and 32x32 multiply-accumulate (MAC) operations, 16x16 dual multiply-accumulate (MAC), Harvard bus architecture, fast interrupt response and processing

6-Channel DMA Controller: 16-bit or 32-bit external interface, over 2M x 16 address range

On-Chip Memory: 256K x 16 Flash, 34K x 16 SARAM; 1K x 16 one-time programmable (OTP) ROM

12-Bit Analog-to-Digital Converter (ADC), 16 Channels – 80ns conversion rate – 2 x 8-channel input multiplexed

Operating Temperature Options: N1 Grade (S): -55°C to 125°C; Wide Temperature Grade (E): -55°C to 125°C – Industrial Grade (I): -40°C to 105°C

Packaging: LQFP176, BGA176