GXSC high-speed ADC replaces ADC12DL3200 for microwave return application

In the field of wireless communication, point to multipoint microwave backhaul systems are used to achieve high-speed data transmission between base stations and end users. In recent years, with the rapid development of mobile communication technology, especially the commercial deployment of 5G networks, the demand for point to multipoint microwave backhaul systems has been increasing. Currently, point to multipoint microwave backhaul systems in the market have significantly improved in transmission rate, spectral efficiency, and anti-interference ability.

Nowadays, microwave return systems are evolving towards higher-order modulation, wider channel bandwidth, and multi polarization diversity. It is necessary to improve the sampling rate, bandwidth, dynamic range, and delay characteristics of analog-to-digital converters (ADCs). This article recommends using GXSC‘s independently designed ADC architecture to replace ADC12DL3200 for microwave return schemes, achieving precise capture and efficient conversion of wideband signals, adapting to low distortion processing of high-order modulation signals, and meeting the deployment requirements of system miniaturization and low power consumption.

The GXSC ADC uses a single power supply and achieves excellent dynamic performance with low consumption below 2W. The chip supports parallel LVDS interface output data with a minimum conversion delay of 10ns. The data interface supports Demux mode and uses up to 48 pairs of LVDS bus parallel output data. The LVDS bus data rate is up to 1.6Gbps, and the data output format can be programmed as offset binary code format and binary complement code format, making it convenient for users to choose and use. The chip supports AutoSync automatic synchronization function and can be used for cascading multiple chips. It supports automatic synchronization of multiple ADCs cascaded on a single board and multiple ADCs cascaded on multiple boards.

Advantages of the GXSC ADC product:

Pin compatible reference model, supports PIN TO PIN replacement ADC12DL3200

Built in dual channel 3.2GSPS ADC, supports single channel 5.0GSPS working mode

Encapsulated as plastic FBGA256, with a working temperature range of -55 ℃ to+105 ℃.

Low power consumption, no need for heat sink

Built in terminal resistor, high-speed buffer

Provide test sequences for system debugging and batch testing

Single power supply 1.9 V power supply

Data latency; 30 main clock cycles

Static performance: DNL-0.4/+0.4LSB, INL-1.8/+2.0LSB

Full power bandwidth: 6.0GHz

Dynamic performance (fs=3.2GSPS, input signal power -1dBFS)

-fin=347MHz； ENOB=8.4Bit，SFDR=70.8dBFS，SNR=52.1dBFS

-fin=997MHz； ENOB=8.3Bit，SFDR=67.9dBFS，SNR=51.9dBFS

-fin=2482Mhz； ENOB=8.1Bit，SFDR=62.4dBFS，SNR=50.4dBFS

-fin=4997Mhz； ENOB=7.5Bit，SFDR=56.5dBFS，SNR=47.0dBFS

-fin=6250MHz； ENOB=7.2Bit，SFDR=52.7dBFS，SNR=45.1dBFS